沉积处理
半导体沉积工艺采用挥发性前体气体、等离子体和高温的组合，在晶圆上沉积高质量的薄膜。沉积室和晶圆处理工具需要耐用的陶瓷部件来承受这些严苛的环境。
沉积室组件
工艺设备在任何地方都会暴露在严酷的沉积条件下或接触晶圆，因此需要工程陶瓷的惰性和耐用特性。

Lithography and wafer inspection
loongceram ultrapure ceramic components are ideally suited for next-
generation lithography and wafer handling applications, ensuring minimal
contamination and providing extremely long service life.
Lithography and wafer inspection components
Chemically resistant and thermally stable, loongcrea’s high-purity ceramic
components are ideal for lithography, wafer handling (low contamination),
and wafer inspection (very high durability and hardness, dimensional stability).
Applications include:

Ion Implantation
From precision air bearing assemblies and beams, to ultra-flat vacuum suction cups and thermally stabilized pins, screws, and frames, advanced ceramic components are designed to meet the demanding requirements and precision characteristics of the ion implantation process.

Diffusion and LPCVD processing
Traditional diffusion, low pressure chemical vapor deposition (LPCVD), and
other bulk semiconductor applications require the heat resistance and purity
characteristics of advanced ceramics. loongceram offers engineered ceramic
components specifically designed to meet the requirements of bulk diffusion
and LPCVD.
Engineering Ceramic Components
Loongceram bietet keramische Komponenten an, die für Bulk-Diffusion und
LPCVD-Anforderungen entwickelt wurden, einschließlich:

Rapid Thermal Processing
Technical Ceramics ist die natürliche Wahl für thermische Verarbeitungsanwendungen
in der Halbleiterindustrie, einschließlich Rapid Thermal Processing (RTP), Epitaxie,
Diffusion, Oxidation und Glühen.
Komponenten für schnelle Wärmebehandlung und Epitaxieverfahren
Loongceram bietet fortschrittliche Materialkomponenten an, die so konzipiert sind,
dass sie Wärmeschocks mit hoher Reinheit und robuster, wiederholbarer Leistung für Hochtemperaturprozesse standhalten:

Semiconductor package
Advanced ceramics have become an irreplaceable material in semiconductor packaging through excellent thermal conductivity, insulation, mechanical and chemical stability, especially in the high-end field (high-frequency, high-power, high-reliability) to occupy a dominant position. In the future, with the development of semiconductor technology to smaller size and higher integration, the innovation of ceramic materials will further enhance the performance of packaging, our products in semiconductor packaging include:

General Purpose Applications and Wafer Handling
We are your partner in customizing advanced ceramic components and
assemblies to help your semiconductor processing equipment achieve highe
r yields and productivity. Our materials experts are ready to work with you
to develop the best solutions for your wafer handling, heating and processing
needs.